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ac/dc drivers ac/dc controller ic for led lighting included 650v mosfet b m521q25f general description bm 52 1 q25 f is a n ac/dc converter for led lighting, which has a built - in mosfet w ith 650v withstand voltage. this ic can be applied to q uasi - resonant ty ped high -s ide led driver application, and the high current precision and l ow emi noise can be achieved. moreover, owing to the built - in pfc (power factor correction) converter, the harmonics is improved. owing to the start - up circuit with 650v withstand voltage, the low power consumption is achieved. and owing to the external current setting resistance, a power supply design with a high degree of freedom can be achiev ed. owing to t he built - in start - up circuit and mosfet with 650v withstand voltage , a compact application can be designed easily, and the low - cost can be achieved with the small bom size. key specification s ? operating p ower s upply v oltage r ange : vcc : 8.9 v to 2 5 .0v drain : to 650v ? operating current : normal o peration : 400 a ( typ ) ? operat ing t emperature r ange : - 40 c to +10 5c ? mosfet on r esistance : 4.0 ( typ ) features ? quasi - resonant s witching m ode + pfc c ircuit ? non - isolated a pplication ? built - in 650v s tart - up c ircuit ? built - in 650v s witching mosfe t ? maximum f requency 30 0khz ? vcc p in: u nder v oltage p rotection ? vcc p in: o ver v oltage p rotection (l atch ) ? source p in: leading - edge - blanking f unction ? source p in: open p rotection f unction ? led o ver c urrent d etection f unction package w(typ) x d(typ) x h(max) sop8 5.00mm x 6.20mm x 1.71mm application led b ulb, d own - light etc. electrical m achineries for led l ighting typical application circuit r1 f1 da1 vin source comp gnd zt drain nc vcc l1 cb cin d1 c2 rs co u1 c3 led+led- ro r4 d2 r3 lpf r2 c1 l2 + dz figure 1 . application c ircuit product structure : silicon monolithic integrated circuit this product has no designed protection against radioactive rays . 1/ 16 tsz02201 - 0f4f0c300090 -1-2 20 . apr .201 6 rev.00 2 ? 20 16 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 www.rohm.com datashee t downloaded from: http:///
b m521q25f abso lute maximum ratings ( ta=25 c) item symbol rating unit condition input v oltage r ange 1 vmax1 - 0.3 to 30 v vcc input v oltage r ange 2 vmax2 - 0.3 to 6.5 v source, comp , l p f, zt input v oltage r ange 3 vmax3 650 v drain drain current pul se i dp 2.60 a p w =10 s, duty c ycle=1% operating t emperature r ange t opr - 40 to +105 o c maximum j unction t emperature tjmax 150 o c storage t emperature r ange t st g - 55 to +150 o c caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider c ircuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. ther mal resistance ( note 1) parameter symbol thermal resistance (typ) unit 1s ( note 3) 2s2p ( note 4) sop8 junction to ambient ja 197.4 109.8 c /w junction to top characterization parameter ( note 2 ) jt 21 19 c /w (note 1) based on jesd51 - 2a(still - air) (no te 2) the thermal characterization parameter to report the difference between junction tem perature and the temperature at the top center of the outside surface of the component package. (note 3) using a pcb board based on jesd51 - 3. (note 4) using a pcb board based on jesd51 - 7. layer number of measurement board material board size single fr -4 114.3mm x 76.2mm x 1.57mmt to p copper pattern thickness footprints and t races 70 m layer number of measurement board material board size 4 layers fr -4 114.3mm x 76.2mm x 1.6mmt to p 2 internal layers bottom copper pattern thickness copper pattern thickness copper pattern thickness footprints and traces 70 m 74.2mm x 74.2mm 35 m 74.2mm x 74.2mm 70 m recommended operating conditions ( ta=25 c) item symbol range unit condition input v oltage r ange 1 v cc 8.9 to 25 .0 v vcc v oltage input v oltage r ange 2 v drain to 650 v drain v oltage electrical characteristics mosfet ( unless otherwise specified v cc =15v ta =25 c) item symbol specification unit condition min typ max drain - source b reakdown v oltage v (br)dds 650 - - v i d =1ma / v gs =0v drain l eakage c urrent i dds - - 100 a v ds =650v / v gs =0v on r esistance r ds(on) - 4 .0 5.5 i d =0.25a / v gs =10v 2/ 16 tsz02201 - 0f4f0c300090 -1-2 20 . apr .201 6 rev.00 2 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
b m521q25f electrical characteristics ic ( unless otherwise specified v cc =15v ta =25 c) item symbol specification unit condition min typ max circuit c urrent circuit current (on) i on - 400 800 a zt =0v(pulse o perating) circuit current (o ff ) i off - 300 600 a zt = 1v (pulse off) vh p in s tart up c ircuit vh s tarting c urrent 1 i start1 0. 20 0.55 0.90 ma vcc= 0v vh s tarting c urrent 2 i start2 1 3 6 ma vcc=10v vh off c urrent i start3 - 10 20 a vcc uvlo r eleased vh p in s ink current vh s tar ting c urrent s witching v oltage v sc 0. 4 0. 8 1.6 v vcc p in vcc p in protection vcc uvlo v oltage 1 v uvlo1 12.5 13.5 14.5 v vcc r ising up vcc uvlo v oltage 2 v uvlo2 7.5 8.2 8.9 v vcc f alling d own vcc uvlo h ysteresis v uvlo3 - 5.3 - v v uvlo3 = v uvlo1 - v uv lo2 vcc ovp t rigger v oltage v ovp1 25 .0 27.5 30 .0 v vcc r ising up vcc ovp r elease v oltage v ovp2 21 .0 23.5 26 .0 v vcc f alling d own latch r eleased vcc v oltage v latch - v uvlo2 - 0.5 - v vcc f alling d own vcc r echarge s tart v oltage v chg1 7.7 8.7 9.7 v vcc f alling d own vcc r echarge e nd v oltage v chg2 12 13 14 v vcc r ising up latch m ask t ime t latch 75 150 300 s [ dc/dc c onverter b lock ( t urn - on ) ] zt c omparator v oltage 1 v zt1 30 110 19 0 mv zt f alling d own zt c omparator v oltage 2 v zt2 100 200 300 mv zt r ising up zt c omparator h ysteresis v zthys 40 90 140 mv v zthys = v zt 2 - v zt 1 zt t rigger t imeout t ztout 9 18 36 s [ dc/dc c onverter b lock ( t urn -off) ] current trigger v oltage v cs 2.60 2.95 3.30 v maximum f requency f sw 255 3 00 345 k hz leading e dge b lank t ime t leb 0.1 0.2 0.4 s error a mplifier r eference v oltage v ref 0.582 0.600 0.618 v 3/ 16 tsz02201 - 0f4f0c300090 -1-2 20 . apr .201 6 rev.00 2 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
b m521q25f pin con f iguration pin descriptio ns table 1. pin f unction s pin no. pin name function 1 zt zero current detecting pin 2 vcc power supply pin 3 n.c. non connection 4 drain internal mosfet drain pin 5 source inter nal mosfet source pin inductor current sensing pin 6 comp error amplifier out put pin 7 gnd gnd pin 8 lpf error amplifier input pin i/o e quivalen ce c ircuit s 1pin : zt 2 pin : vcc / 7pin : gnd 4 pin : drai n zt(1) 50 100 10k 25k 200k 300k drain(4) vcc(2) jfet gnd(7) block drain(4) source(5) vcc(2) jfet mosfet 5pin : source 6pin : comp 8pin : lpf drain(4) source(5) mosfet vref4v 1m 18k 25k 4k 10k 10k comp(6) lpf(8) 10k 1 figure 3. i/o e quivalent c ircuit s (top view) lpf gnd source zt vcc n.c. drain comp 7 8 6 5 3 4 2 figure 2. pin c onfiguration 4/ 16 tsz02201 - 0f4f0c300090 -1-2 20 . apr .201 6 rev.00 2 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
b m521q25f block diagram hv starter vcc (2) logic 12v clamper 200ns l.e.b. 150us mask s r q rs tsd vccuvlo vccrechg vccovp ocp nout ztcomp nout startcomp max freq. power supply vccuvlo vref4v vref4v r2 driver zt (1) gnd (7) 0.8v 13v/ 8.7v 13.5v/ 8.2v 27.5v/ 23.5v 110mv/ 200mv 1m 2.95v istart1=0.55ma istart2=3ma istart3=10ua source (5) drain (4) r1 f1 cin c1 c3 d1 l2 co led+ led- eamp 0.6v comp (6) osc c2 d2 lpf (8) ro r3 cb l1 da1 r4 + vin + - - + + - +- +- +- +- +- dz figure 4. block d iagram 5/ 16 tsz02201 - 0f4f0c300090 -1-2 20 . apr .201 6 rev.00 2 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
b m521q25f description of block s (1) start - up c ircuit b lock ( vcc:2pin, drain : 4 pin) (1. 1)block description a start - up circuit with 650v withstand voltage is built in this ic. owing to this, the low - power standby and high - speed start can be achieved. after the ic was booted up, the power consumption becomes only the idling current i start3 ( typ =10 a). hv starter block vccuvlo vccrechg startcomp 0.8v 13v/ 8.7v 13.5v/ 8.2v istart1=0.55ma istart2=3ma istart3=10ua jfet on on drain (4) r1 f1 cin vcc (2) istart1 istart2 istart3 c1 da1 cb l1 d2 r3 gnd (7) vin i start1 i start2 v sc v uvlo1 10v vcc voltage[v] i start3 0 start-up current [a] figure 5 . start - up c ircuit b lock d iagram figure 6. start - up current vcc v oltage c urve 6/ 16 tsz02201 - 0f4f0c300090 -1-2 20 . apr .201 6 rev.00 2 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
b m521q25f ( 1. 2) start s equence s the time chart of the start sequences are showed in figure 8. vin source(5) gnd(7) drain(4) vcc(2) r1 f1 da1 l1 + cb cin d1 dz rs co u1 ro d2 r3 c1 l2 led+led- comp(6) c3 figure 7 . dc/dc s chematic vcc(2) comp(6) switching i_led vuvlo1 vuvlo2 (a) (b) (c) (e) (d) (f) ac power supply off on off figure 8 . on/off s equences on/off s equences a : input voltage is applied to drain pin while the ac power supply turns to on . b: the capacitor connected to the vcc pin is charged by the star t- up current from the drain pin, and the vcc rises up. c: t he ic starts operating when v cc > v uvlo1 ( typ =13.5v). d: by the increasing of the comp pin voltage, the ic starts up with the soft start operation. e: the current is supplied to vcc pin from led+ and d2 by the switching operation. the power is supplied from v led , and t h e vcc voltage is determined by the v dz (the breakdown voltage of dz). v cc =v led -v dz -vf d2 (v led : the vf of led, v dz : the breakdown voltage of dz, vf d2 : the vf of d2 ) f : when the power supply turns off, vcc voltag e falls down d ue to the drop of the power supply . th e ic turns off when the v uvlo2 ( typ =8.2v) is triggered. 7/ 16 tsz02201 - 0f4f0c300090 -1-2 20 . apr .201 6 rev.00 2 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
b m521q25f ( 1. 3) vcc p in p rotection f unction the vcc under voltage protection function vcc uvlo ( under voltage lock out), over voltage protection function vcc ovp (over voltage protection), and a vcc re charge function which operates when a voltage drop occurs at vcc pin are built in this ic. the vcc uvlo and vcc ovp function s are u sed for prevent ing the destructions of the switching mosfet which occurs when the vcc voltage is too high or too low. owing to the vcc charge function , the vcc pin is charged from high voltage lines by the start circuit when the vcc voltage drops . vcc uvlo / vcc ovp f unction vcc uvlo and vcc ovp are auto recovery comparator s whi ch have voltage hysteresis. vcc ovp has a built - in mask time t latch ( typ =1 50 s). when the vcc voltage is over v ovp 1 ( typ =27.5v ) ,and this state lasts t latch , the detection is executed. owing to this function, the surge which occurs at vcc pin can be masked . vc c c harge f unction when the vcc pin voltage is over v uvlo1 ( typ =13.5v) , the ic starts up. in this case, if the vcc pin voltage drops below v chg1 ( typ =8.7v) , vcc charge function operates . at th is time , the vcc pin is charged from the drain pin through the start - up circuit . owing to this operation , the failure of start - up can b e prevented . v uvlo1 (typ=13.5v) on off v ovp1 (typ=27.5v) switching v uvlo2 (typ=8.2v) vcc uvlo function on off off vcc ovp function on off a b c off internal latch signal l : normal h : latch g v latch (typ=7.7v) time v ovp2 (typ=23.5v) h g i on off d v chg2 (typ=13v) v chg1 (typ=8.7v) vcc recharge function on off on off on v sc (typ=0.8v) e f istart2 (typ=3ma) istart1 istart2 on lkj vcc (2) under t latch (typ=150us) over t latch (typ=150us) istart1 (typ=550ua) drain (4) a : drain pin voltage is applied , vcc voltage rises by the charging current istart1 ( typ = 550 a). b: vcc voltage > v sc ( typ =0.8v) , the charging current to vcc changes from i start1 to istart2( typ =3ma) c: vcc voltage > v chg 2 ( typ =13v) , though vcc charge function reacts, due to vcc uvlo is detected, the charge continues. d: vcc voltage > v uvlo 1 , the vcc u vlo is released, and dc/dc operation starts, the charge to vcc stops. e: vcc voltage < v chg 1 , the charge to vcc restarts. f: vcc voltage > v chg2 , vcc recharge function stops.. g: vcc voltage > v ovp 1 , vcc ovp is detected. h: vcc voltage < v ovp 2 ( typ =23.5v) , if v cc voltage drops below v ovp 2 in t latch , vcc ovp is released , and the latch will not be activated. i: vcc voltage > v ovp2 , if this state is kept longer than t latch , the switching stops by latch. j: vcc voltage< v uvlo 2 ( typ =8.2v) , vcc uvlo is detected. k: vc c voltage< v latch ( typ =7.7v) , the latch state is released. l: vcc voltage < v sc , the charging current to vcc changes from i start2 to istart1 . figure 9. timing c hart of vcc uvlo/ vcc ovp / vcc c harge f unction 8/ 16 tsz02201 - 0f4f0c300090 -1-2 20 . apr .201 6 rev.00 2 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
b m521q25f (2) error a mplifier b lock ( source: 5pin, comp: 6 pin, lpf: 8pin ) (2. 1)block description an error amplifier is b uilt in this ic, the gate on time of the built - in mosfet is changed by controlling the output of the error amplifier. the voltage which occurs on the curre nt sensing resistor rs (source p in v oltage) is inputted to the low pass filter circuit which is comp osed by r4,c2. t he output of the low pass filter circuit (lpf p in v oltage) is used as the input voltage of the error amplifier, and the summation of the current which flows through the inductor l2 while the mosfet is on, and the current which flows through the inductor l2 from the flywheel diode d1 while the mosfet is off flows through the rs. +- + - comp eamp source(5) comp(6) drain(4) ton control rs c3 lpf(8) gnd(7) c2 r4 l2 + - vref4v 1m v ocp (typ=2.95v) v ref (typ=0.6v) stop d1 figure 10 . diagram of error a mplifier b lock ( 2. 2) source p in ocp ocp (over current protection) function is built - in source pin. when source pin voltage reached the detection voltage v ocp ( typ = 2.95v), mosfet switches from on to off. (a utomatic r ecovery p rotection ) ( 2. 3) l.e.b b lanking p eriod w hen the internal mosfet is turned on, surge current occurs by the capacit ive component s a nd drive current. in this case , if the source pin voltage rises temporarily , false detection s may occur in the ocp function . for prevent ing from the false detections, a l.e.b ( leading edge blanking ) function which masks the source voltage during a constant time t leb ( typ = 200ns ) after mosfet switches fr o m off to on is built in. (2 . 4 ) source p in o pen p rotection w hen the source pin becomes open, this function stops the switching operation for protection. ( a utomatic r ecovery p rotection ) 9/ 16 tsz02201 - 0f4f0c300090 -1-2 20 . apr .201 6 rev.00 2 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
b m521q25f (3) zero c urrent d etection b lock ( zt : 1pin ) (3. 1)block description zt pin controls the off time of the internal mosfet gate signal. while the mosfet is off, the current flows from the flywheel diode d1 to the inductor l2 . while the current i l is close to zero, the voltag e of zt pin falls down. while the voltage becomes lower than v zt1 typ =1 10 mv , it is detected by the zt comparator, and the mosfet turns to on. v zt1 (typ=110mv) source (5) il zt (1) 0a mosfet gate (internal) il zt (1) mosfet gate (internal) figure 11 . zero - cross detection by zt p in (3.2 ) zt tigger timeout in case of the zt pin is locked at low voltage which is caused by some malfunctions of the components on the application board, and the q uasi - resonant s witching operation stops, the mosfet is forced to turn on after t ztout ( typ = 18 s). i l zt (1) mosfet gate (internal) t out_on ztout t ztout t ( a ) ( b ) ( c ) v zt1 t out_on 0a source (5) f igure 12 . zt trigger timeout operation (a) when the on time (t out_on ) which is determined by the voltage of comp pin passed, the mosfet turns off. (b) the zt pin is locked at a low voltage, so the mosfet does not turns on. (c) when t ztout passed after the mosfet turns off, the mosfet is forced to turn on. (3.3) maximum frequency the maximum frequency is a function which is designed for preventing the overheating from of the ic , and it limits the ic to operate under the f max ( typ = 300khz). il source (5) zt (1) mosfet gate (internal) ( a ) out_on t v zt1 ( b ) ( c ) t ztout t max = 1 / f max [s] t max 0a figure 13 . maximum f requency o peration (a) when the on time (t out_on ) which is determined by the voltage of comp pin passed, the mosfet turns off. (b) if the switching frequency exceeds the f max , the mosfet cannot turn on. (c) when t ztout p assed after the mosfet turns off, the mosfet is forced to turn on. 10 / 16 tsz02201 - 0f4f0c300090 -1-2 20 . apr .201 6 rev.00 2 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
b m521q25f operation m ode of p rotection c ircuit operation mode of protection functions are shown in table 2. table 2. operation m ode of p rotection c ircuit abnormal state d etection detect ion release protection o perations vcc uvlo <= 8.2v ( typ ) >= 13.5v ( typ ) ic s tops (a utomatic r ecovery ) ovp >=27.5v ( typ ) before l atch <= 23.5v ( typ ) latched v cc <= 7.7v ( typ ) 150 s( typ ) timer l atch source ocp >= 2.95 v( typ ) <2.95v ( typ ) output s tops (a utomatic r ecov ery) tsd >=1 75 o c ( typ ) before l atch <= 1 55 o c ( typ ) latched v cc <= 7.7v ( typ ) 150 s( typ ) timer l atch 11 / 16 tsz02201 - 0f4f0c300090 -1-2 20 . apr .201 6 rev.00 2 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
b m521q25f operational notes 1. reverse c onnection of p ower s upply connecting the power supply in reverse polarity can damage the ic. take pr ecautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic s power supply pin s. 2. power s upply l ines design the pcb layout pattern to provide low impedance supply lines. s eparate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affect ing the analog block . furthermore, connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors . 3. g round voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient con dition. 4. g round w iring pattern when using both small - signal and larg e- current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuatio ns in the small - signal ground caused by large currents. also ensure that the ground traces of external compo nents do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line im pedance. 5. thermal c onsideration should by any chance the maximum junction temperature rating be exceeded the rise in t emperature of the chip may result in deterioration of the properties of the chip. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the maximum junction t emperature rating . 6. recom mended o perating c onditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the conditions of each parameter . 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unst able and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if t he ic has more than one power supply. therefore, give special consideration to power coupling capacitance, p ower wiring, width of ground wiring, and routing of connections. 8. operation u nder s trong e lectromagnetic f ield operating the ic in the presence of a strong electromagnetic field may cause the ic to malfu nction . 9. testing on a pplication b oards when testing the ic on an application board, connecting a capacitor directly to a low - impedance output pin may subject the ic to stress. always discharge capacitors completely after each proce ss or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the i nspection process. to prevent damage from static discharge, ground the ic during assembly and use s imilar precautions during transport and stor age. 10. inter- pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter - pin shorts could be due to many reasons such as metal particles, water droplets (i n very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few . 12 / 16 tsz02201 - 0f4f0c300090 -1-2 20 . apr .201 6 rev.00 2 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
b m521q25f operational notes C continued 11. unu sed input terminals input pins of an ic are often connected to the gate of a mos transistor. the gate has extremely high i mpedance and extremely low capacitance. if left unconnected, the electric field f rom the outside can easily charge it. the small charg e acquired in this way is enough to produce a significant effect on the conduction through the tr ansistor and cause unexpected operation of the ic. so unless otherwise specified, unused input pins should be connected to the power supply or ground line . 12. re garding the i nput p in of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in order to keep them isolated. p - n junctions are formed at the intersection of the p layers with the n layers of other elements, crea ting a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p - n junction operates as a parasitic diode. when gnd > pin b, the p - n junction operates as a parasitic transistor. parasitic diodes inevit ably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. therefore , conditions that cause these diodes to operate, such as applying a voltage lower th an the gnd voltage to an input pin (and thus to the p substrate) should be avoided . fig ure 14. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant consider ing the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and the maximum junction temp erature rating are all within the area of safe opera tion (aso) . 15. thermal s hutdown circuit(tsd) this ic has a built - in thermal shutdown circuit that prevents heat damage to the ic. normal operation should always be within the ics maximum junction temperature rating. if however the rating is exceeded for a c ontinued period, the junction temperature (tj) will rise which will activate the tsd circuit that will t urn off all output pins. the ic should be powered down and turned on again to resume normal operation because the tsd circ uit keeps the outputs at the o ff state even if the tj falls below the tsd threshold. note that the tsd circuit operates in a situation that exceeds the absolute maximum rat ings and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other than protect ing the ic from heat damage. 16. over c urrent p rotection c ircuit (ocp) this ic incorporates an integrated overcurrent protection circuit that is activat ed when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by continuous operation or transitioning of the prot ection circuit. 13 / 16 tsz02201 - 0f4f0c300090 -1-2 20 . apr .201 6 rev.00 2 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
b m521q25f ordering information b m 5 2 1 q 2 5 f - xx product name package f: sop8 packaging and forming specification xx: please confirm the formal name with our salesmen. marking diagram sop8(top v iew) 21q25 part number marking lot number 1pin mark 14 / 16 tsz02201 - 0f4f0c300090 -1-2 20 . apr .201 6 rev.00 2 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
b m521q25f physical dimension , tape and reel information package name sop8 (unit : mm) pkg : sop8 drawing no. : ex11 2- 5001 -1 (max 5.35 (include.burr)) 15 / 16 tsz02201 - 0f4f0c300090 -1-2 20 . apr .201 6 rev.00 2 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
b m521q25f revision history date revision changes 18. jan .201 6 001 new release 20.apr.2016 002 p2 footprints and traces changed the representation of the units. 74.2mm 2 (square) ? 74.2 mm x 74.2 mm 16 / 16 tsz02201 - 0f4f0c300090 -1-2 20 . apr .201 6 rev.00 2 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufactured for application in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely h igh reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear powe r controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in adv ance. unless otherwise agreed in writing by rohm in advance, rohm s hall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arisin g from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific appl ications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to stri ct quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequ ate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified be low. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from th e use of any rohms products under any special or extraordinary environments or conditions. if yo u intend to use our products under any special or extraordinary environments or conditions (as exemplified belo w), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be n ecessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6 . in particular, if a transient load (a large amount of load appl ied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7 . de -rate power dissipation depending on ambient temperature. wh en used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range desc ribed in the product specification. 9 . rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc .) flux is used, the residue of flux may negatively affect prod uct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mus t be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts , please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, p lease allow a sufficient margin considering variations o f the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and a ssociated data and information contained in this docum ent are presented only as guidance for products use. therefore, i n case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take pr oper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate i f the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderabil ity of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indi cated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a c arton. 4. use products within the specified time after opening a humi dity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label a two-dimensional barcode printed on rohm products label is f or rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to appl ication example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, a ctions or demands arising from the combination of the products with other articles such as components, circuits, systems or ex ternal equipment (including software). 3. no license, expressly or implied, is granted hereby under any inte llectual property rights or other rights of rohm or any third parties with respect to the products or the information contai ned in this document. provided, however, that rohm will not assert it s intellectual property rights or other rights against you or you r customers to the extent necessary to manufacture or sell products containing the products, subject to th e terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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